Failure-Free Integrated Circuit Packages Systematic Elimination of Failures Through Reliability Engineering, Failure Analysis, and Material Improvements

Failure-Free Integrated Circuit Packages is a new book in Charles Harper's Electronic Packaging and Interconnection Series. The subtitle explains further what this book is focusing on, namely the systematic elimination of failures through reliability engineering, failure analysis, and material improvements. The publication makes ample us of illustrations and has the depth and breadth to become a useful quality guide for manufacturers and users of integrated circuit packages.

The co-editors Charles Cohn (Agere Systems) and Charles Harper (Technology Seminars, Inc.) have assembled a knowledgeable group of authors, all employees of Agere Systems, many of them bringing a wealth of insight based on their experience with AT&T and Lucent Technologies, the grandparents and parents of Agere Systems. While some might be critical of this book in that it reflects the practices of only one company, the fact is that the book comes from the organization that literately "wrote the books" on quality and reliability that established the high standards in the electronic industry that we have today. The authors of the chapters in this edited book have in-depth, long experience in their individual subjects creating an excellent reference book.

Reliability of advanced IC packages is a hot topic more so than ever. The use of brittle low Dk dielectric in the redistribution layers of the IC makes these chips more prone to cracking than ICs with all SiO2 dielectric layers. Better CTE (coefficient of thermal expansion) match of all package layers to the low CTE of the IC becomes important, as does the use of buffer or compliant layers. The very fine pitch and tight via spacing on build-up dielectric microvia layers makes these packages more susceptible to CAF (conductive anodic filament) formation. Furthermore, no-lead solders require higher reflow temperatures and thermal management has become critical as thermal densities of ICs approach 100 W/cm2.

The book is structured into eight chapters: an introduction and overview, fundamentals of IC package technologies, reliability, physics and chemistry of failures in packaged devices, strategies for locating failures, failure analysis techniques, failure modes common in organic IC packages, and emerging assembly materials for IC packaging. The chapters on strategies for locating failures, failure analysis techniques, and examples of failure modes common in organic IC packages make up the bulk of the book. The Strategies for Locating Failures chapter contains three useful case studies that employ finite element modeling and design of experiments to probe root causes of failures.

The Melissa E. Grupen-Shemansky's Introduction provides a good overview and "roadmap" to the chapters in the book. It provides important background for the reader to understand the changes in the industry structure and the issues in insuring a high level of quality and reliability in what has become a complex supply chain.

Charles Cohn's chapter on the "Fundamentals of IC Package Technologies" is well done and, while there are some minor historical inaccuracies, provides excellent background on mature as well as emerging technologies useful to both the novice and those experienced in the field. Charles does not assume that the reader is familiar with the alphabet soup of package names, and he carefully explains acronyms when they first appear. The author has subdivided the technologies into four generic types comparing attributes and tradeoffs, physical properties and rankings. ... the chapter is a very good overall summary of packaging technology.

Jason P. Goodelle's and John W. Osenbach's chapter on Emerging Assembly Materials for IC Packaging give useful insight in the relationship between chemical structures and chemical and mechanical properties of materials as they impact package reliability. ...

The failure analysis chapters are profusely illustrated with charts, graphs and photographs for easy understanding of defects and failure modes. A very effective case study approach is used to lead one through the various steps from problem recognition to fault location to cause and solution. Guideline charts and protocols or strategies for analysis are detailed. The examples of test vehicles for reliability testing and case study examples are most useful for they address issues with large I/O new and advanced package types. ... This book is one that should be a primary reference for anyone involved in IC packaging, Reliability or Quality engineering.Cohn, Charles is the author of 'Failure-Free Integrated Circuit Packages Systematic Elimination of Failures Through Reliability Engineering, Failure Analysis, and Material Improvements', published 2004 under ISBN 9780071434843 and ISBN 0071434844.