5103746

9789040725265

Atomistic Simulation of Cu/ta Thin Film Deposition & Other Phenomena

Atomistic Simulation of Cu/ta Thin Film Deposition & Other Phenomena

Out of Stock

The item you're looking for is currently unavailable.

Ask the provider about this item.

Most renters respond to questions in 48 hours or less.
The response will be emailed to you.
Cancel
  • ISBN-13: 9789040725265
  • ISBN: 9040725268
  • Publication Date: 2004
  • Publisher: IOS Press, Incorporated

AUTHOR

Klaver, Peter

SUMMARY

Contents include: Introduction, Thin Ta films: growth, stability, and diffusion studied by molecular dynamics simulations, Molecular dynamics study of Cu thin film deposition on B-Ta, Molecular dynamics simulations of Cu/Ta and Ta/Cu thin film growth, The interaction of N with atomically dispersed Ti, V, Cr, Mo, and Ni in ferritic steel, Density functional theory study of alloy element interstitials in Al, Summary.Klaver, Peter is the author of 'Atomistic Simulation of Cu/ta Thin Film Deposition & Other Phenomena ', published 2004 under ISBN 9789040725265 and ISBN 9040725268.

[read more]

Questions about purchases?

You can find lots of answers to common customer questions in our FAQs

View a detailed breakdown of our shipping prices

Learn about our return policy

Still need help? Feel free to contact us

View college textbooks by subject
and top textbooks for college

The ValoreBooks Guarantee

The ValoreBooks Guarantee

With our dedicated customer support team, you can rest easy knowing that we're doing everything we can to save you time, money, and stress.