Area Array Packaging Processes for Bga, Flip Chip, and Csp

This expert monograph on area array packaging processes delivers concise coverage of leading-edge assembly and manufacturing methods. Featuring the manufacturing processes and equipment of today's state-of-the-art electronic packaging, clearly explained by a team of world-class professionals and researchers, Area Array Packaging Processes and Equipment details cost-effective manufacturing methods you won't find elsewhere. Look inside for: * Expert information on key processes * Cutting-edge, in-depth coverage of processes for each area array technology * Data on flip chip materials, processes, assembly, and underfilling * BGA and CSP rework solutions * Detailed descriptions of die-attach methods, materials, and rework * Coverage of liquid encapsulation equipment and processes and molding for area array packaging * Discussions of cost, quality, reliability, cycling, tooling, failure mechanisms, productivity, and moreGilleo, Ken is the author of 'Area Array Packaging Processes for Bga, Flip Chip, and Csp' with ISBN 9780071428293 and ISBN 0071428291.