Area Array Packaging Materials Adhesives, Pastes, and Lead-Free

Covering the broad range of materials used in today's electronic packaging -- and emphasizing lead-free options -- this concise tutorial on area array solders and fluxes provides leading-edge, environmentally friendly solutions. Written by a team of world-class professionals and researchers, Area Array Packaging Materials gives you hands-on expertise and cutting-edge information on lead-free adhesives, pastes, polymers, and more. Look inside for: * Expert information on materials that can save days of searching * The newest area array lead-free solder systems, adhesives and encapsulants, pastes, fluxes, underfills, finishes, and polymer materials * Assembly solutions for today's packaging, emphasizing lead-free options * Electrically conductive adhesive alternatives for flip chip and surface mount processes * Hands-on help with practical issues of performance, reliability, storage, molding, manufacturing, and more * Coverage of cost, environmental, standards compliance, failure analysis, and other essential considerations * Nearly 70 illustrations clarifying key conceptsGilleo, Ken is the author of 'Area Array Packaging Materials Adhesives, Pastes, and Lead-Free' with ISBN 9780071428286 and ISBN 0071428283.